Megasonic cleaning not only preserves the advantages of ultrasonic cleaning, but also overcomes its disadvantages. When cleaning, the wave length of the transducer is 1 μ 8 MHz. The maximum instantaneous velocity of solution molecules can reach 30cm / s. Therefore, the high-speed fluid wave can continuously impact the wafer surface, so that the fine particles of pollutants attached to the wafer surface can be forced to be removed and enter into the cleaning solution.

Applicable time:

(1) Optical products with fine dust particles less than 0.2um and extremely clean process

(2) Nano cleaning of slit in wafer and circuit wafer process

(3) . can speed up the rinsing process

(4) Avoid damaging the workpiece due to low frequency blasting vibration

(5) . effectively prevent particles from re adhering on the surface of silicon wafer